Synonyms for xaui or Related words with xaui
Examples of "xaui"
Aeluros was the first to produce a
transceiver dissipating less than 1 Watt of power,
The following is a list of the major concepts of XGXS and
Typically used for on-chip connections; in chip-to-chip usage mostly replaced by
Optical modules are connected to a host by either a
, XFI or SFI interface. XENPAK, X2, and XPAK modules use
to connect to their hosts.
(XGXS) uses a four-lane data channel and is specified in IEEE 802.3 Clause 48. XFP modules use a XFI interface and SFP+ modules use an SFI interface. XFI and SFI use a single lane data channel and the 64b/66b encoding specified in IEEE 802.3 Clause 49.
The newer modules have a purely serial interface, compared to the four "lane"
interface used in XENPAK.
The XGMII Extender is transparent to the Reconciliation Sublayer and PHY device, and operates symmetrically with similar functions on the DTE transmit and receive data paths. The XGMII Extender is logically composed of two XGXSs interconnected with a
data path in each direction. One XGXS acts as the source to the
data path in the DTE transmit path and as the destination in the receive path. The other XGXS is the destination in the transmit path and source in the receive path. Each
data path is composed of four serial lanes. All specifications for the XGMII Extender are written assuming conversion from XGMII to
and back to XGMII, but other techniques may be employed provided that the result is that the XGMII Extender operates as if all specified conversions had been made. One example of this is the use of the optional
with the 10GBASE-LX4 8b/10b PHY, where the XGXS interfacing to the Reconciliation Sublayer provides the PCS and PMA functionality required by the PHY. An XGXS layer is not required at the PHY end of the
in this case. However, means may still be required to remove jitter introduced on the
in order to meet PHY jitter requirements.
is a standard for extending the XGMII (10 Gigabit Media Independent Interface) between the MAC and PHY layer of 10 Gigabit Ethernet (10GbE).
is pronounced "zowie", a concatenation of the Roman numeral X, meaning ten, and the initials of "Attachment Unit Interface".
Soon after the standard was introduced in 2001, two related standards emerged: XPAK and X2. These two standards have the same electrical interface as XENPAK (known as
) but different mechanical properties.
The RapidIO Specification Revision 1.2, released in 2002, defined a serial interconnect based on the
physical layer. Devices based on this specification achieved significant commercial success within wireless baseband, imaging and military compute.
The PICMG 3.1 Ethernet/Fibre Channel specification has been revised to include IEEE 100GBASE-KR4 signaling to the existing IEEE 40GBASE-KR4, 10GBASE-KX4, 10GBASE-KR, and
The implementation of
as an optional XGMII Extender is primarily intended as a chip-to-chip (integrated circuit to integrated circuit) interface implemented with traces on a printed circuit board. Where the XGMII is electrically limited to distances of approximately 7 cm, the XGMII Extender allows distances up to approximately 50 cm.
The Fabric is commonly SerDes Gigabit Ethernet, but can also be Fibre Channel,
10-Gigabit Ethernet, InfiniBand, PCI Express, or Serial RapidIO. Any Fabric that can use the point-to-point 100 Ω differential signals can be used with an AdvancedTCA backplane.
HiGig is a proprietary protocol that is implemented by Broadcom. The HiGig protocol supports various switching functions like quality of service (QoS), link aggregation, and others. The physical signaling across the interface is
, four differential pairs for receive and transmit (SerDes), each operating at 3.125 Gbit/s. HiGig+ is a higher rate version of HiGig. HiGig can be compared to the Interlaken protocol.
Transceivers are called Medium Attachment Units (MAUs) in IEEE 802.3 documents and were widely used in 10BASE2 and 10BASE5 Ethernet networks. Fiber-optic gigabit, 10 Gigabit Ethernet, 40 Gigabit Ethernet, and 100 Gigabit Ethernet utilize transceivers known as GBIC, SFP, SFP+, QSFP, XFP,
, CXP, and CFP.
XFI provides a single lane running at 10.3125 Gbit/s when using a 64B/66B encoding scheme. A serializer/deserializer is often used to convert between XFI and a wider interface such as
that has four lanes running at 3.125 Gbit/s using 8B/10B encoding.
10GBASE-CX4 was the first 10G copper standard published by 802.3 (as 802.3ak-2004). It uses the
4-lane PCS (Clause 48) and copper cabling similar to that used by InfiniBand technology. It is specified to work up to a distance of . Each lane carries 3.125 GBd of signaling bandwidth.
TILE"Pro"64 has four DDR2 controllers at up to 800MT/s, two 10-gigabit Ethernet
interfaces, two four-lane PCIe interfaces, and a "flexible" input/output interface, which can be software-configured to handle a number of protocols. The processor is fabricated using a 90 nm process and runs at speeds of 600 to 866 MHz.
The purpose of the XGMII Extender, which is composed of an XGXS (XGMII Extender Sublayer) at the MAC end, an XGXS at the PHY end and a
between them, is to extend the operational distance of the XGMII and to reduce the number of interface signals. Applications include extending the physical separation possible between MAC and PHY components in a 10 Gigabit Ethernet system distributed across a circuit board.
They are commonly used to analyze a pair of coupled transmission lines to determine the amount of cross-talk between them, if they are driven by two separate single ended signals, or the reflected and incident power of a differential signal driven across them. Many specifications of high speed differential signals define a communication channel in terms of the 4-Port S-Parameters, for example the 10-Gigabit Attachment Unit Interface (
), SATA, PCI-X, and InfiniBand systems.
The following standard, Fast Ethernet introduces division onto Media Access Controller (MAC) and Physical Layer Interface (PHY) layers connected with Media Independent Interface (MII). Some early Fast Ethernet hardware had a physical external MII connectors, functionally similar to AUI connector. However, the tradition of using a separate low-level I/O device in networking has continued in fast optical fiber network interfaces, where the GBIC, XENPAK, XFP, and enhanced small form-factor pluggable (SFP+) pluggable transceiver modules using the
interface play a similar role.
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